| 产品应用 | 产品描述 | 产品型号 | 温度级别 | 量产状态 | 规格书 |
| 1.25/2.5G SR SFP | 2.5G 850nm VCSEL chip | GT-V-2.5-850-C-B-B-01 | I(工温)/E (扩展)/C(商温) | MP | 查看 |
| 2.5G 850nm PD chip | GT-P-2.5-850-C-B-B-01 | I/E/C | MP | 无 | |
| 10G SR SFP/AOC | 10G 850nm VCSEL chip | GT-V-10-850-C-B-B-01 | I/E/C | MP | 查看 |
| 10G 850nm PD chip | GT-P-10-850-C-B-B-01 | I/E/C | MP | 查看 | |
| 25G SR SFP28/AOC | 25G 850nm VCSEL chip | GT-V-25-850-C-B-B-01 | I/E/C | MP | 查看 |
| 25G 850nm PD chip | GT-P-25-850-C-B-B-01 | I/E/C | MP | 查看 | |
| 40G SR4/AOC | 4*10G 850nm VCSEL chip | GT-V-10-850-C-B-B-04 | I/E/C | MP | 查看 |
| 4*10G 850nm PD chip | GT-P-10-850-C-B-B-04 | I/E/C | MP | 无 | |
| 100G SR4/AOC | 4*25G 850nm VCSEL chip | GT-V-25-850-C-B-B-04 | I/E/C | MP | 查看 |
| 4*25G 850nm PD chip | GT-P-25-850-C-B-B-04 | I/E/C | MP | 无 | |
| 10G LR SFP | 10G 1310nm DFB chip | GT-D-10-310-C-B-B | I/E/C | MP | 查看 |
| 10G 1310nm DFB TO | GT-D-10-310-C-B-B-TO-56 | I/E/C | MP | 无 | |
| 10G CWDM SFP | 10G 1270nm DFB chip | GT-D-A-270-C-D-B | I/E/C | Sample | 查看 |
| 10G 1290nm DFB chip | GT-D-10-290-A-B-B | I/E/C | Sample | 无 | |
| 10G 1310nm DFB chip | GT-D-10-310-A-B-B | I/E/C | Sample | 无 | |
| 10G 1330nm DFB chip | GT-D-10-330-A-B-B | I/E/C | Sample | 无 | |
| 10G 1270nm DFB TO | GT-D-10-270-A-B-B-TO-56 | I/E/C | Sample | 无 | |
| 10G 1290nm DFB TO | GT-D-10-290-A-B-B-TO-56 | I/E/C | Sample | 无 | |
| 10G 1310nm DFB TO | GT-D-10-310-A-B-B-TO-56 | I/E/C | Sample | 无 | |
| 10G 1330nm DFB TO | GT-D-10-330-A-B-B-TO-56 | I/E/C | Sample | 无 | |
| 10G PON XGS-PON | 10G 1270nm DFB chip | GT-D-10-270-C-B-B | I/E/C | Sample | 无 |
| 10G 1270nm DFB TO | GT-D-10-270-C-B-B-TO-56 | I/E/C | Sample | 无 |
版权所有：杰创半导体 备案号：苏ICP备2023003426号
苏州公司：杰创半导体（苏州）有限公司
联系电话：13970437505